JPS61199069A - めっき液濃度自動連続管理装置 - Google Patents
めっき液濃度自動連続管理装置Info
- Publication number
- JPS61199069A JPS61199069A JP60039951A JP3995185A JPS61199069A JP S61199069 A JPS61199069 A JP S61199069A JP 60039951 A JP60039951 A JP 60039951A JP 3995185 A JP3995185 A JP 3995185A JP S61199069 A JPS61199069 A JP S61199069A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- amount
- concentration
- replenishment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 186
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 238000007726 management method Methods 0.000 claims description 18
- 238000004458 analytical method Methods 0.000 claims description 13
- 239000004615 ingredient Substances 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 3
- 239000000470 constituent Substances 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 24
- 239000003795 chemical substances by application Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 10
- 235000011121 sodium hydroxide Nutrition 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 6
- 238000005070 sampling Methods 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 235000010265 sodium sulphite Nutrition 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 210000003323 beak Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WVMHLYQJPRXKLC-UHFFFAOYSA-N borane;n,n-dimethylmethanamine Chemical compound B.CN(C)C WVMHLYQJPRXKLC-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Automation & Control Theory (AREA)
- Chemically Coating (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60039951A JPS61199069A (ja) | 1985-02-28 | 1985-02-28 | めっき液濃度自動連続管理装置 |
| US07/406,863 US5182131A (en) | 1985-02-28 | 1989-09-13 | Plating solution automatic control |
| US07/842,507 US5200047A (en) | 1985-02-28 | 1992-02-27 | Plating solution automatic control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60039951A JPS61199069A (ja) | 1985-02-28 | 1985-02-28 | めっき液濃度自動連続管理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199069A true JPS61199069A (ja) | 1986-09-03 |
| JPH0343346B2 JPH0343346B2 (en]) | 1991-07-02 |
Family
ID=12567269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60039951A Granted JPS61199069A (ja) | 1985-02-28 | 1985-02-28 | めっき液濃度自動連続管理装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5182131A (en]) |
| JP (1) | JPS61199069A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03291384A (ja) * | 1990-04-06 | 1991-12-20 | Hitachi Chem Co Ltd | 無電解めっき方法及び装置 |
| WO1993021359A1 (en) * | 1992-04-17 | 1993-10-28 | Nippondenso Co., Ltd. | Method of and apparatus for detecting concentration of chemical processing liquid and automatic control apparatus for the same method and apparatus |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5368715A (en) * | 1993-02-23 | 1994-11-29 | Enthone-Omi, Inc. | Method and system for controlling plating bath parameters |
| US5631845A (en) * | 1995-10-10 | 1997-05-20 | Ford Motor Company | Method and system for controlling phosphate bath constituents |
| KR100201377B1 (ko) * | 1995-10-27 | 1999-06-15 | 김무 | 다성분 도금용액의 농도조절장치 |
| US5993892A (en) * | 1996-09-12 | 1999-11-30 | Wasserman; Arthur | Method of monitoring and controlling electroless plating in real time |
| US7147827B1 (en) * | 1998-05-01 | 2006-12-12 | Applied Materials, Inc. | Chemical mixing, replenishment, and waste management system |
| WO2000003073A2 (en) * | 1998-07-13 | 2000-01-20 | Dj Parker Company, Inc. D/B/A Parker Systems | Paced chemical replenishment system |
| JP2001020077A (ja) * | 1999-07-07 | 2001-01-23 | Sony Corp | 無電解めっき方法及び無電解めっき液 |
| US6521112B1 (en) * | 1999-07-13 | 2003-02-18 | Dj Parker Company, Inc. | Paced chemical replenishment system |
| US6974951B1 (en) | 2001-01-29 | 2005-12-13 | Metara, Inc. | Automated in-process ratio mass spectrometry |
| US6524642B1 (en) | 2001-04-21 | 2003-02-25 | Omg Fidelity, Inc. | Electroless metal-plating process |
| US7220383B2 (en) | 2001-07-13 | 2007-05-22 | Metara, Inc. | Method and instrument for automated analysis of fluid-based processing systems |
| US7531134B1 (en) | 2002-03-08 | 2009-05-12 | Metara, Inc. | Method and apparatus for automated analysis and characterization of chemical constituents of process solutions |
| US6773760B1 (en) * | 2003-04-28 | 2004-08-10 | Yuh Sung | Method for metallizing surfaces of substrates |
| US7851222B2 (en) * | 2005-07-26 | 2010-12-14 | Applied Materials, Inc. | System and methods for measuring chemical concentrations of a plating solution |
| CN102471918B (zh) * | 2009-07-16 | 2015-05-27 | 朗姆研究公司 | 无电沉积溶液和工艺控制 |
| JP5714428B2 (ja) * | 2011-06-24 | 2015-05-07 | 東京エレクトロン株式会社 | めっき処理装置、めっき処理方法および記憶媒体 |
| CN109143421B (zh) * | 2018-06-27 | 2022-09-27 | 深圳市锦瑞新材料股份有限公司 | 一种退镀工艺 |
| CN119553345A (zh) * | 2025-01-27 | 2025-03-04 | 江苏台祥自动化科技有限公司 | 一种电镀药剂的自适应添加装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602386A (ja) * | 1983-06-20 | 1985-01-08 | Rohm Co Ltd | 熱印字ヘツド |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926660B2 (ja) * | 1979-03-07 | 1984-06-29 | 株式会社東芝 | 無電解メツキ反応の測定方法 |
| DE2911073C2 (de) * | 1979-03-21 | 1984-01-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer |
| US4406249A (en) * | 1979-11-14 | 1983-09-27 | C. Uyemura & Co., Ltd. | Apparatus for controlling electroless plating bath |
| JPS6016517B2 (ja) * | 1979-12-29 | 1985-04-25 | 上村工業株式会社 | 無電解めつき制御方法 |
| US4556845A (en) * | 1982-05-17 | 1985-12-03 | International Business Machines Corporation | Method for monitoring deposition rate using an eddy current detector |
| US4479980A (en) * | 1983-12-16 | 1984-10-30 | International Business Machines Corporation | Plating rate monitor |
| US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
-
1985
- 1985-02-28 JP JP60039951A patent/JPS61199069A/ja active Granted
-
1989
- 1989-09-13 US US07/406,863 patent/US5182131A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602386A (ja) * | 1983-06-20 | 1985-01-08 | Rohm Co Ltd | 熱印字ヘツド |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03291384A (ja) * | 1990-04-06 | 1991-12-20 | Hitachi Chem Co Ltd | 無電解めっき方法及び装置 |
| WO1993021359A1 (en) * | 1992-04-17 | 1993-10-28 | Nippondenso Co., Ltd. | Method of and apparatus for detecting concentration of chemical processing liquid and automatic control apparatus for the same method and apparatus |
| US5450870A (en) * | 1992-04-17 | 1995-09-19 | Nippondenso Co., Ltd. | Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343346B2 (en]) | 1991-07-02 |
| US5182131A (en) | 1993-01-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |